LEEP: Definition and Clinical Application
LEEP stands for Loop Electrosurgical Excision Procedure, a technique used for diagnosis and treatment of cervical dysplastic lesions. 1
Definition and Terminology
- LEEP is also known by several other names including:
Technical Aspects
- LEEP uses low-current, high-frequency electrical generators and thin stainless steel or tungsten loops to excise either specific lesions or the entire transformation zone of the cervix 1
- The procedure produces cone-shaped tissue specimens that can be examined histologically, providing material for definitive diagnosis 2
- LEEP can be performed as an outpatient procedure, typically in a clinician's office setting 1, 3
Clinical Applications
- LEEP is primarily used for:
Advantages Over Other Methods
- LEEP provides tissue specimens for histological evaluation, unlike ablative procedures such as cryotherapy 5, 1
- The procedure can be performed under local anesthesia with minimal discomfort 2
- LEEP is cost-effective compared to hospital-based procedures ($700 vs. $1450) 3
- It requires fewer patient visits compared to other treatment methods 1
- The technique is relatively easy to learn and implement in a family practice setting 1, 3
Limitations and Considerations
- LEEP may be associated with tissue fragmentation (45.2% vs. 8.5% with cold knife conization) 4
- There are concerns about interpretability of resection margins in some cases 4
- Women of reproductive age should be counseled about potential increased risks of preterm birth before undergoing LEEP 6, 7
- For adolescents and young women, observation rather than immediate treatment is often recommended due to high regression rates of cervical lesions 6
When to Use LEEP vs. Other Methods
- LEEP is preferred over ablative methods when:
- Cold knife conization may be preferred when:
LEEP has become an important tool in the management of cervical dysplasia, offering a balance between diagnostic accuracy and treatment efficacy while minimizing patient discomfort and healthcare costs 1, 3.